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Tác giả: Geraldine C. Schwartz, Kris V. Srikrishnan

Chủ đề: Technology--Progress

Kiểu tài liệu: Tài liệu Điện tử

Chuyên ngành: Khoa Điện - Điện tử

Ngày cập nhật: 12/30/2011 2:09:50 PM

Từ khóa: Semiconductor Interconnection Technology

Ngôn ngữ: Tiếng Anh

Kích cỡ: 11.8 MB

Chương trang: 511 p.

Nguồn: http://timsach.com.vn

Updated information on tools used for evaporation, chemical vapor deposition, and plasma processes, emphasis on measurement of mechanical and thermal properties of insulators, recently reported methods for characterizing porous dielectric thin films, greater focus on integration issues and properties of titanium, cobalt, and nickel silicides, new process schemes based on the increased need for borderless contact gates and source/drain, expanded discussion on recently reported choices for low-dielectric insulators, more emphasis on electroplated copper, especially morphology of plated films and their properties