CSDL sách
001
000001438
003
LDTU
020
$a0471347000
041
$aeng
082
$a621.381 73
100
$aHamer, D.W $etác giả
245
$aThick Film Hybrid Microcircuit Technology $cD.W. Hamer, J.V. Biggers
260
$aUnited States of America $bWiley $c1972
300
$a424 p. $c23 cm
520
$aChapter 1: Introduction to thick film microelectromics; Chapter 2: A fist look at thick film technology; Chapter 3: The economic rationale for thick film hybrids; Chapter 4: Thick film materials; Chapter 5: Screen printing; Chapter 6: Firing thick films; Chapter 7: Properties of thick film components; Chapter 8: Trimming thick film elements; Chapter 9: Bonding and soldering; Chapter 10: Discrete devices for thick film circuits; Chapter 11: Packaging; Chapter 12: Artwork, layout and design; Chapter 13: The economics of thick film hybrid microcircuits production.
650
$aMicroelectronics
653
$aMicroelectronics
700
$aBiggers, J.V $e tác giả
852
$a7/25 Quang Trung $bNgoại văn
911
Trần Thị Hậu
927
Tặng
928
34769
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