CSDL sách
- Electromigration in ULSI Interconnections
- Tác giả: Cher Ming Tan
- Nhà xuất bản: World Scientific - Singapore
- Năm xuất bản: 2010
- Số trang:291 p.
- Kích thước:24 cm
- Số đăng ký cá biệt:48305
- ISBN:9789814273329
- Mã Dewey:621.381584
- Đơn giá:0
- Vị trí lưu trữ:03 Quang Trung
- Ngôn ngữ:English
- Loại tài liệu:Sách Tham Khảo
- Đang rỗi/ Tổng sách:4/4
- Từ khóa:Electrodiffusion, integrated circuits
- Chủ đề: Integrated circuits & Electrodiffusion
- Chuyên ngành: Khoa Điện - Điện tử
- Tóm tắt: Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained.
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